Silicone thermal paste created by Genesis specifically designed to improve heat conduction between electronic components and heat sinks. This thermal paste has a thermal conductivity of 11 W/m·K, a density of 1.6 g/cm³, a volume of 1.25 ml and a weight of 2 g. It comes in a single sealed blister packaging. This thermal paste is ideal for use on computers, laptops, graphics cards, processors, motherboards, sound cards, network cards, television cards, video cards and more. It is designed to be compatible with all electronic components and to be easy to use. It is silver in color and offers excellent temperature resistance, leaves no residue, is non-toxic and does not contain oil or alcohol. It is formulated with state-of-the-art technology to offer excellent heat dissipation. Manufactured by Genesis with reference NTG-1326.

Specifications

• Type: Thermal paste
• Thermal conductivity: 11 W/m K.
• Density: 1.6 g/cm³.
• Volume: 1.25 ml.
• Weight: 2g.
• Packaging type: Blister.
• Ideal for computers, laptops, graphics cards, processors, motherboards, sound cards, network cards, television cards, video cards and more.
• Compatibility: All electronic components.
• Easy to use.
• Excellent temperature resistance, leaves no residue, is non-toxic and does not contain oil or alcohol.
• Formulated with state-of-the-art technology to offer excellent heat dissipation.
• Silver colour.

• Gross Weight: 10 g
• Product size (width x depth x height): 15.0 x 6.0 x 2.0 cm
• Number of packages: 1
• Packages size: 15.0 x 6.0 x 2.0 cm
• Master-pack: 1