Genesis 850 silicone thermal paste ideal for high performance processors. It comes in a 1-piece package with a volume of 0.8 ml and a weight of 2 g. It is designed with a gray color and a thermal resistance of 0.001 ° C/W with a thermal conductivity of 13.4 W/m K. It is designed to work with a wide variety of technologies, including the latest generation processors, graphics cards, motherboards, and cooling systems. It is ideal for heat dissipation in computer systems, audio and video equipment, game consoles, etc. It offers a simple connection and easy installation. It is an effective thermal solution to keep the components of a computer system at an optimal temperature. It has superior thermal resistance and thermal conductivity, allowing it to transfer heat much more efficiently. It is designed to be compatible with a wide variety of systems, and is easily applicable to any computer system. Manufactured by Genesis with reference of NTG-1605.

Specifications

• It comes in a 1-piece package with a volume of 0.8 ml and a weight of 2 g.
• Thermal resistance of 0.001 °C/W with a thermal conductivity of 13.4 W/m·K.
• Ideal for high-performance processors, graphics cards, motherboards, and cooling systems.
• Ideal for heat dissipation in computer systems, audio and video equipment, game consoles, etc.
• Superior thermal resistance and thermal conductivity.
• Compatible with a wide variety of systems.
• Easily applicable to any computer system.
• Gray.

• Gross Weight: 24 g
• Product size (width x depth x height): 18.5 x 9.5 x 2.0 cm
• Number of packages: 1
• Packages size: 18.5 x 9.5 x 2.0 cm
• Master-pack: 1